Taiwanese IC Packaging & Testing Industry, 1Q 2017

2017-03-13
Price :
Published : Mar-2017
No. of Pages : 16

The report finds that shipment value of the Taiwanese IC packaging and testing industry continued to grow sequentially and year-on-year to approximately US$3.55 billion in the fourth quarter of 2016. This was mainly attributed to growing demand for chips found in variety of applications such as IoT microcontrollers, smart car sensors, and graphic cards, virtual reality headsets, and wearable devices. With shipment value of USD 13.0 billion,   Taiwan’s global share is estaimated at 53.6%, making it the world’s largest fabless IC industry.

List of Topics

  • This research report presents shipment value forecast and recent quarter review of the Taiwanese IC packaging and testing industry.
  • Companies surveyed in this research are contract manufacturers focusing on IC packaging and testing for IC suppliers around the world.
  • The content of this report is based on primary data obtained from interviews, and publicly available information.

Companies covered

Ardentec, ASE, Chipbond, ChipMOS, FATC, KYEC, OSE, PTI, Sigurd, SPIL, Walton

Filed in: Semiconductor & Electronics
Publisher : Market Intelligence & Consulting Institute, MIC
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