The rapid rise of smart handheld devices, smart wearables, and IoT (Internet of Things) has driven the need for chipsets that have high integration and low power consumption capabilities. In addition to SiP (System in Package) and SoC (System on Chip), the industry has been seeking other embedded memory technologies and eNVM (embedded Non-Volatile Memory) solutions in particular have been drawing significant attention. This report investigates the development of logic eNVM including OTP/MTP solutions, in smart wearables and IoT and examines its future potential thereof.
Apple, Atmel, Broadcom, Cambridge Enterprise, Chingus, eMemory, Epson, ESMT, Etron, FlashSilicon, Freescale Semiconductor, GlobalFoundries, Headwater Partners, IBM, Identifi Technologies, Impinj, Infineon, Inotera, Intel, Kilopass, Koninkl Philips, Lattice Semiconductor, Macronix, Mag Instrument, Marvell Technology, Micron Technology, Microsoft, Monolithic, Monolithic System, MoSys, Motorola, Nanya, Novocell Semiconductor, NXP BV, Panasonic, Parker Hannifin, Philips, Phison Electronics, R828 LLC, Renesas, Samsung, SanDisk, SenCal LLC, Sidense, SMIC, Socket Mobile, Sony, Spansion, SST, STMicro, Synopsys, Texas Instruments, Tower Semiconductor, TSMC, UMC, Unity Semiconductor, Virage Logic, Winbond, Xilinx, YMC, Zilog
List of Topics
- Development of eNVM technology and its application markets covering smart wearable devices and smart networks, known as IOT
- Highlight of eNVM OTP and MTP technology solutions, touching on how much OTP and MTP differ in term of cell structure, erase format, storage volume, technology maturity, and reprehensive firms
- Rankings of top-20 patent applicants filed for eNVM and includes the number of applications per individual applicant
- Pros and cons of eNVM technology development in the future