This research report presents market size and value forecast and recent quarter review of the Taiwanese smartphone baseband, transceiver, power amplifier, application processor, GPS IC, Bluetooth IC, and Wi-Fi IC markets. The report includes baseband, transceiver, power amplifier, application processor, GPS IC, Bluetooth IC, and Wi-Fi IC market volume, value, ASP, and market share by solution provider. The content of this report is based on primary data obtained through interviews with smartphone component makers. The report finds that Taiwanese smartphone application IC market volume grew 49% sequentially in the fourth quarter of 2013, due largely in part to strong sales of Apple iPhones. Following the strong growth, Taiwanese smartphone application IC market volume is anticipated to decline considerably in the first quarter of 2014. One of the most important points to note is that Taiwanese smartphones’ adoption share of IC solutions from MediaTek and Intel has been increasing and seems likely to increase further, as the future chance of Taiwanese ODMs/OEMs landing Chinese branded and white-box smartphone orders is high.
Apple, Broadcom, China Mobile, Coolpad, Gigabyte, Hisense, HTC, Infineon, Intel, Lenovo, Marvell, MediaTek, Nokia, Nvidia, Qualcomm, Samsung, Sequans, SiRF/CSR, ST-Ericsson, T3G, TI, Xiaomi