Semiconductor Advanced Process Technologies: Competitive Analysis of Intel, Samsung, and TSMC

Table of Contents

1. Analysis of Advanced Process Technologies
1.1 Technology Roadmaps
1.1.1 Intel's Technology Leadership Had Little Impact on Pure-play Foundries
1.1.2 TSMC Dominates 20nm Process; Samsung Has a Head Start in 14nm Process
1.1.3 TSMC, Samsung Head-to-Head Competition for 10nm Process
1.2 Development of Key Technologies
1.2.1 Vendors Pursue 3D FinFET in Sub-2xnm Designs
1.2.2 TSMC Gets the Upper Hand over Samsung on 16/14nm Process
1.2.3 Samsung Faces More Challenges at 10nm Technology
1.2.4 Vendors All Focus on 3D IC Packaging Services
1.3 Capital Expenditures (Capex)
1.3.1 TSMC Concentrates on Advanced Process Investments

2. Analysis of Manufacturing Capabilities
2.1 Diversified Production Lines to Strengthen Competitiveness
2.1.1 TSMC Continues to Expand Market Share of Homogeneous ICs
2.1.2 Samsung, Intel Have a Head Start in Heterogeneous Integration
2.2 Smart Manufacturing to Create Economic Benefits
2.2.1 TSMC can Use Big Data Analytics to Widen its Advantage

3. Analysis of Customer Relationship
3.1 Samsung, Intel May Have Lower Customer Trust

Conclusion
Intel Strengthens Advanced Process Capacity by Acquisitions
Samsung Could Focus on Heterogeneous Integration
TSMC Needs to Reinforce Cooperation with Memory Vendors on 3D ICs
Appendix
Glossary of Terms
List of Companies

List of Figures

Figure 1: Major Vendors' Advanced Technology Roadmap
Figure 2: Comparison of Major Vendors' Key Technologies
Figure 3: Comparison of Major Vendors' Packaging & Testing Technologies
Figure 4: Comparison of Major Vendors' Capex, 2011-2014
Figure 5: Product Lines of Major Vendors' Contract Manufacturing Services
Figure 6: Application of Big Data Analytics on Semiconductor Fabrication
Figure 7: Major Vendors' Position in the Semiconductor Industry Chain