Taiwan’s semiconductor industry still remains ahead of China in terms of shipment value and technology development, but China has been catching up fast, with an aim to beef up the industry with a series of governmental preferential and incentive policies to attract foreign investors. This report outlines the key developments of the semiconductor industry in China and Taiwan, comprising mainly of fabless IC design, IC manufacturing, and packaging & testing industry sectors; examines the major battleground between China and Taiwan in the semiconductor industry while probing into China’s incentive policies and consequences thereof on the global semiconductor industry in 2014 and beyond.
Companies covered
Allwinner, Apple, ASE, ASMC, BBK, Beijing Industrial Developing Investment Management Cooperation, Bejing KT Micro, China Electronics Cooperation, Coolpad, Country Mate Technology, CR Microelectronics, Datang Semiconductor, Diga Device, Freescale, GalaxyCore, Gionee, Great Wall, Himax, Hisilicon, Hitech, Hua Capital, Huahong NEC, Huawei, Hynix, ILItek, Infineon, Intel, Intel Semiconductor, JCET, LeadCore, Lenovo, Marvell, MediaTek, Micron, Montage, Morningstar, Nantong Huada Microelectronics, Nari Smartchip, Novatek, OmniVision, On-Bright, Oppo, Orise, Panasonic, Panda, Phison, PowerTech, PTL, PuDong, Qualcomm, Raydium, RDA Microelectronics, Realtek, RFMD, Richtek, Rockchip, Samsung, SDIC, Silan, Sino-Microelectronics, SMIC, Solomon, SPIL, Spreadtrum, STATS, Superpix, Tian Shui Hua Tian, Tongfang, TPV, TSMC, UMC, VeriSilicon, Vimicro, Xi’an XIGU Microelectronics, Xiaomi, Zhongguancun Development Group, ZTE