Future Trends of the Worldwide TSV 3D IC Industry

Table of Contents

1 Development of Global Packaging Technologies
1.1 SiP to Become Mainstream Technology
1.2 TSV 3D IC: The Future Trend of Packaging Technology
1.3 Uniqueness of TSV 3D IC Technology
1.4 Existing Challenges for TSV 3D IC
1.5 Foreign Players' Leading Position in TSV 3D IC

2 Development of TSV 3D IC Market
2.1 Strong Growth Potential
2.1 Mass Production Activities Remain Low
2.2 Market Growth to Speed Up with Technological Enhancement

3 Development of the TSV 3D IC Industry
3.1 Formation of Cross-industry Alliances
3.2 Taiwanese IC Design Houses' Absence in HMCC
3.3 Close Cooperation between Taiwanese Upstream and Downstream Players Required

MIC Perspective

Appendix

List of Tables

Table 1  Current Challenges in TSV 3D IC Development
Table 2  Technology Development and Mass Production Timetable of Taiwanese and Foreign TSC IC Chipmakers
Table 3  TSV-based ICs Mass Produced as of Year-end 2014
Table 4  Impact on Taiwan's Semiconductor Industry

List of Figures

Figure 1  Development of Electronic Devices and Packaging Technologies
Figure 2  Comparison of TSV 3D IC and Other Packaging Technologies
Figure 3  Production Process of TSV 3D IC
Figure 4  Worldwide TSV 3D IC Industry Value Forecast, 2014 - 2017
Figure 5  Major Players' Development Plan in 2015 and 2016
Figure 6  Comparison of Industry Alliances Worldwide
Figure 7  Participation of Taiwanese and Korean HMCC Members