Worldwide and Taiwanese Semiconductor Packaging & Testing Industry, 2015 and Beyond

2015-09-08
Price :
Published : Sep-2015
No. of Pages : 16

Table of Contents

1. Trends in Worldwide and Taiwanese IC Packaging and Testing Industries
1.1 China's Market Share Sees Fastest Growth
1.2 Uncertain Market Growth for 2015

2. Future of Worldwide and Taiwanese IC Packaging and Testing Industries
2.1 Aggressive Expansion
2.2 SiP to Become Key Technology
2.3 Influence of IC Foundries' Development of High-end Heterogeneous Packaging Technologies

Conclusion
Industry's Optimism about the Future on the Wane
Enhancement in Technology and Production Capacity as Key to Stay Ahead

Appendix
Glossary of Terms
List of Companies

List of Tables

Table 1: Worldwide and Taiwanese IC Packaging and Testing Vendor's Capacity Expansion, 2013 - 2015

List of Figures

Figure 1: Worldwide Top 10 IC Packaging and Testing Vendors by Revenue, 2014
Figure 2: Worldwide IC Packaging and Testing Market Share by Region, 2012 - 2015
Figure 3: Worldwide and Taiwanese IC Packaging and Testing Industry Shipment Value, 2014 - 2017
Figure 4: Evolution of End-User Devices and Packaging Technologies
Figure 5: Leading IC Foundries' High-end Heterogeneous Packaging Technologies

Filed in: Semiconductor & Electronics
Publisher : Market Intelligence & Consulting Institute, MIC